RR0816P-1333-D
vs
RR0816P1333D-C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
THIN FILM TECHNOLOGY CORP
THIN FILM TECHNOLOGY CORP
Package Description
CHIP
CHIP, ROHS COMPLIANT
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
JESD-609 Code
e0
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Packing Method
TR
TR
Rated Power Dissipation (P)
0.0625 W
0.0625 W
Resistance
133000 Ω
133000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0603
0603
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
25 ppm/°C
25 ppm/°C
Terminal Finish
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.5%
0.5%
Working Voltage
75 V
75 V
Base Number Matches
3
1
Pbfree Code
Construction
Chip
Package Height
0.406 mm
Package Length
1.6 mm
Package Style
SMT
Package Width
0.787 mm
Compare RR0816P1333D-C with alternatives