RP73PG1J1K0BTDF
vs
RP73PG1J1K0BTG
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TE CONNECTIVITY LTD
TE CONNECTIVITY LTD
Package Description
CHIP
CHIP
Reach Compliance Code
unknown
unknown
Construction
Rectangular
Rectangular
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.45 mm
0.45 mm
Package Length
1.55 mm
1.55 mm
Package Style
SMT
SMT
Package Width
0.8 mm
0.8 mm
Packing Method
TR, PAPER, 7 INCH
TR
Rated Power Dissipation (P)
0.166 W
0.166 W
Rated Temperature
70 °C
70 °C
Resistance
1000 Ω
1000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0603
0603
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
50 ppm/°C
50 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.1%
0.1%
Working Voltage
100 V
100 V
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8533.21.00.30
Compare RP73PG1J1K0BTDF with alternatives
Compare RP73PG1J1K0BTG with alternatives