RP73PF1J118RBTDF
vs
RP73PF1J118RBTDG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TE CONNECTIVITY LTD
TE CONNECTIVITY LTD
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8533.21.00.30
Factory Lead Time
10 Weeks, 3 Days
Samacsys Manufacturer
TE Connectivity
Additional Feature
PRECISION
HIGH PRECISION
Construction
Rectangular
Chip
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.45 mm
0.45 mm
Package Length
1.55 mm
1.55 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
0.8 mm
0.8 mm
Packing Method
TR
TR, PAPER, 7 INCH
Physical Dimension
1.55mm x .8mm x .45mm
Rated Power Dissipation (P)
0.166 W
0.166 W
Rated Temperature
70 °C
70 °C
Resistance
118 Ω
118 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0603
0603
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
25 ppm/°C
25 ppm/°C
Terminal Finish
MATTE TIN OVER NICKEL
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.1%
0.1%
Working Voltage
100 V
100 V
Base Number Matches
1
1
Reference Standard
MIL-STD-202
Compare RP73PF1J118RBTDF with alternatives
Compare RP73PF1J118RBTDG with alternatives