RP73G2E274KDTDF
vs
WF10T2743DTLQ
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TE CONNECTIVITY LTD
WALSIN TECHNOLOGY CORP
Package Description
CHIP
CHIP
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8533.21.00.30
Additional Feature
HIGH PRECISION
HIGH PRECISION
Construction
Chip
Rectangular
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.55 mm
Package Length
3.1 mm
3.1 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.4 mm
2.6 mm
Packing Method
TR, PAPER, 7 INCH
TR, PAPER, 7 INCH
Rated Power Dissipation (P)
0.3 W
0.25 W
Rated Temperature
70 °C
70 °C
Reference Standard
MIL-STD-202
AEC-Q200
Resistance
274000 Ω
274000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1210
1210
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
50 ppm/°C
50 ppm/°C
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.5%
0.5%
Working Voltage
200 V
200 V
Base Number Matches
1
1
JESD-609 Code
e3
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Compare RP73G2E274KDTDF with alternatives
Compare WF10T2743DTLQ with alternatives