RP73G1J11R8DTDF vs TP0350D11R8TCE feature comparison

RP73G1J11R8DTDF TE Connectivity

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TP0350D11R8TCE Royal Electronic Factory (Thailand) Co Ltd

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TE CONNECTIVITY LTD ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP
Reach Compliance Code unknown compliant
Construction Rectangular Chip
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.55 mm 1.6 mm
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method TR, PAPER, 7 INCH TR, Paper
Rated Power Dissipation (P) 0.1 W 0.1 W
Rated Temperature 70 °C
Resistance 11.8 Ω 11.8 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Surface Mount YES
Technology THIN FILM THIN FILM
Temperature Coefficient 50 ppm/°C 50 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 0.5% 0.5%
Working Voltage 75 V 75 V
Base Number Matches 1 1
ECCN Code EAR99
Series TP

Compare RP73G1J11R8DTDF with alternatives

Compare TP0350D11R8TCE with alternatives