RP73F2B180KDTDF vs RP73F2B180KDTN feature comparison

RP73F2B180KDTDF TE Connectivity

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RP73F2B180KDTN TE Connectivity

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Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TE CONNECTIVITY LTD TE CONNECTIVITY LTD
Package Description CHIP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.6 mm
Package Length 3.05 mm 3.2 mm
Package Style SMT SMT
Package Width 1.55 mm 1.6 mm
Packing Method TR, PAPER, 7 INCH TR
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C
Resistance 180000 Ω 180000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 0.5% 0.5%
Working Voltage 200 V 200 V
Base Number Matches 1 1

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