RP73F1E8K45BTDF
vs
RP73F1E8K45BTDG
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TE CONNECTIVITY LTD
|
TE CONNECTIVITY LTD
|
Package Description |
CHIP
|
CHIP
|
Reach Compliance Code |
unknown
|
unknown
|
Construction |
Rectangular
|
Chip
|
JESD-609 Code |
e3
|
|
Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
155 °C
|
155 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
0.3 mm
|
0.3 mm
|
Package Length |
1 mm
|
1 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
0.5 mm
|
0.5 mm
|
Packing Method |
TR, PAPER, 7 INCH
|
TR, PAPER, 7 INCH
|
Rated Power Dissipation (P) |
0.063 W
|
0.063 W
|
Rated Temperature |
70 °C
|
70 °C
|
Resistance |
8450 Ω
|
8450 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Size Code |
0402
|
0402
|
Surface Mount |
YES
|
YES
|
Technology |
THIN FILM
|
THIN FILM
|
Temperature Coefficient |
25 ppm/°C
|
25 ppm/°C
|
Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
|
Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
Tolerance |
0.1%
|
0.1%
|
Working Voltage |
25 V
|
25 V
|
Base Number Matches |
1
|
1
|
Additional Feature |
|
HIGH PRECISION
|
Manufacturer Series |
|
RP73
|
Package Shape |
|
RECTANGULAR PACKAGE
|
Reference Standard |
|
MIL-STD-202
|
Series |
|
RP73
|
|
|
|
Compare RP73F1E8K45BTDF with alternatives
Compare RP73F1E8K45BTDG with alternatives