RP73F1E56KBTG
vs
RN73F1ETD5602B
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TE CONNECTIVITY LTD
MERITEK ELECTRONICS CORP
Package Description
CHIP
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
Additional Feature
HIGH PRECISION
Construction
Rectangular
Chip
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.3 mm
0.3 mm
Package Length
1 mm
1 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
0.5 mm
0.5 mm
Packing Method
BULK
TR, Paper
Rated Power Dissipation (P)
0.063 W
0.0625 W
Rated Temperature
70 °C
Reference Standard
MIL-STD-202
Resistance
56000 Ω
56000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0402
0402
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
25 ppm/°C
25 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.1%
0.1%
Working Voltage
25 V
25 V
Base Number Matches
1
1
Compare RP73F1E56KBTG with alternatives
Compare RN73F1ETD5602B with alternatives