RP73F1E52R3BTD vs TC02G52R3BC feature comparison

RP73F1E52R3BTD TE Connectivity

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TC02G52R3BC Fenghua (HK) Electronics Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TE CONNECTIVITY LTD FENGHUA ADVANCED TECHNOLOGY
Package Description CHIP CHIP, ROHS COMPLIANT
Reach Compliance Code unknown unknown
Construction Rectangular Rectangular
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.3 mm 0.3 mm
Package Length 1 mm 1 mm
Package Style SMT SMT
Package Width 0.5 mm 0.5 mm
Packing Method TR, PAPER, 7 INCH BULK
Rated Power Dissipation (P) 0.063 W 0.0625 W
Rated Temperature 70 °C 70 °C
Resistance 52.3 Ω 52.3 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0402 0402
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.1% 0.1%
Working Voltage 25 V 25 V
Base Number Matches 3 1
Pbfree Code Yes
ECCN Code EAR99
HTS Code 8533.21.00.30
Package Shape RECTANGULAR PACKAGE

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