RP73F1E475RBTDF
vs
RN73F1ETD4750B
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TE CONNECTIVITY LTD
MERITEK ELECTRONICS CORP
Package Description
CHIP
CHIP, ROHS COMPLIANT
Reach Compliance Code
unknown
compliant
Construction
Rectangular
Rectangular
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.3 mm
0.3 mm
Package Length
1 mm
1 mm
Package Style
SMT
SMT
Package Width
0.5 mm
0.5 mm
Packing Method
TR, PAPER, 7 INCH
TR, PAPER
Rated Power Dissipation (P)
0.063 W
0.0625 W
Rated Temperature
70 °C
70 °C
Resistance
475 Ω
475 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0402
0402
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
25 ppm/°C
25 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.1%
0.1%
Working Voltage
25 V
25 V
Base Number Matches
1
1
Pbfree Code
Yes
ECCN Code
EAR99
HTS Code
8533.21.00.30
Additional Feature
PRECISION
Package Shape
RECTANGULAR PACKAGE
Compare RP73F1E475RBTDF with alternatives
Compare RN73F1ETD4750B with alternatives