RP73F1E475RATDF vs RP73F1E475RBTDG feature comparison

RP73F1E475RATDF TE Connectivity

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RP73F1E475RBTDG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TE CONNECTIVITY LTD TE CONNECTIVITY LTD
Package Description CHIP CHIP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.3 mm 0.3 mm
Package Length 1 mm 1 mm
Package Style SMT SMT
Package Width 0.5 mm 0.5 mm
Packing Method TR, PAPER, 7 INCH TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.063 W 0.063 W
Rated Temperature 70 °C 70 °C
Resistance 475 Ω 475 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0402 0402
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.05% 0.1%
Working Voltage 25 V 25 V
Base Number Matches 1 1
Additional Feature HIGH PRECISION
Manufacturer Series RP73
Package Shape RECTANGULAR PACKAGE
Reference Standard MIL-STD-202
Series RP73

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Compare RP73F1E475RBTDG with alternatives