RP73F1E38R3BTDG vs TC02G38R3BC feature comparison

RP73F1E38R3BTDG TE Connectivity

Buy Now Datasheet

TC02G38R3BC Fenghua (HK) Electronics Ltd

Buy Now Datasheet
Yes Yes
Obsolete Active
TE CONNECTIVITY LTD FENGHUA ADVANCED TECHNOLOGY
CHIP CHIP, ROHS COMPLIANT
unknown unknown
HIGH PRECISION
Chip Rectangular
RP73
SURFACE MOUNT SURFACE MOUNT
2 2
155 °C 155 °C
-55 °C -55 °C
0.3 mm 0.3 mm
1 mm 1 mm
RECTANGULAR PACKAGE RECTANGULAR PACKAGE
SMT SMT
0.5 mm 0.5 mm
TR, PAPER, 7 INCH BULK
0.063 W 0.0625 W
70 °C 70 °C
MIL-STD-202
38.3 Ω 38.3 Ω
FIXED RESISTOR FIXED RESISTOR
RP73
0402 0402
YES YES
THIN FILM THIN FILM
25 ppm/°C 25 ppm/°C
WRAPAROUND WRAPAROUND
0.1% 0.1%
25 V 25 V
1 1
Yes
EAR99
8533.21.00.30
e3
Tin (Sn) - with Nickel (Ni) barrier

Compare RP73F1E38R3BTDG with alternatives

Compare TC02G38R3BC with alternatives