RP73D2B4R75BTDF
vs
RP73D2B4R75ATD
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TE CONNECTIVITY LTD
TE CONNECTIVITY LTD
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
unknown
Factory Lead Time
10 Weeks, 3 Days
Samacsys Manufacturer
TE Connectivity
Additional Feature
PRECISION
Construction
Rectangular
Rectangular
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.55 mm
Package Length
3.05 mm
3.05 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
1.55 mm
1.55 mm
Packing Method
TR
TR, PAPER, 7 INCH
Physical Dimension
3.2mm x 1.6mm x .6mm
Rated Power Dissipation (P)
0.25 W
0.25 W
Rated Temperature
70 °C
70 °C
Resistance
4.75 Ω
4.75 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1206
1206
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
15 ppm/°C
15 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.1%
0.05%
Working Voltage
200 V
200 V
Base Number Matches
1
3
ECCN Code
EAR99
HTS Code
8533.21.00.30
Compare RP73D2B4R75BTDF with alternatives
Compare RP73D2B4R75ATD with alternatives