RP73D2B2K21BTDF vs RP73D2B2K21BTDG feature comparison

RP73D2B2K21BTDF TE Connectivity

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RP73D2B2K21BTDG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TE CONNECTIVITY LTD TE CONNECTIVITY LTD
Package Description CHIP CHIP
Reach Compliance Code compliant unknown
Factory Lead Time 10 Weeks, 3 Days
Samacsys Manufacturer TE Connectivity
Additional Feature PRECISION HIGH PRECISION
Construction Rectangular Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.05 mm 3.05 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.55 mm 1.55 mm
Packing Method TR TR, PAPER, 7 INCH
Physical Dimension 3.05mm x 1.55mm x .55mm
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C 70 °C
Resistance 2210 Ω 2210 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 15 ppm/°C 15 ppm/°C
Terminal Finish MATTE TIN OVER NICKEL
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.1% 0.1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8533.21.00.30
Manufacturer Series RP73
Reference Standard MIL-STD-202
Series RP73

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