RP73D2A1K18BTD
vs
RP73D2A1K18BTDF
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TE CONNECTIVITY LTD
TE CONNECTIVITY LTD
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8533.21.00.30
Construction
Rectangular
Rectangular
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.55 mm
Package Length
2 mm
2 mm
Package Style
SMT
SMT
Package Width
1.25 mm
1.25 mm
Packing Method
TR, PAPER, 7 INCH
TR
Rated Power Dissipation (P)
0.125 W
0.125 W
Rated Temperature
70 °C
70 °C
Resistance
1180 Ω
1180 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0805
0805
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
15 ppm/°C
15 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
MATTE TIN OVER NICKEL
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.1%
0.1%
Working Voltage
150 V
150 V
Base Number Matches
1
1
Factory Lead Time
10 Weeks, 3 Days
Samacsys Manufacturer
TE Connectivity
Additional Feature
PRECISION
Package Shape
RECTANGULAR PACKAGE
Physical Dimension
2mm x 1.25mm x .55mm
Compare RP73D2A1K18BTD with alternatives
Compare RP73D2A1K18BTDF with alternatives