RP73A2B11KBTDF vs RP73A2B11KATDG feature comparison

RP73A2B11KBTDF TE Connectivity

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RP73A2B11KATDG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TE CONNECTIVITY LTD TE CONNECTIVITY LTD
Package Description CHIP CHIP
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.05 mm 3.05 mm
Package Style SMT SMT
Package Width 1.55 mm 1.55 mm
Packing Method TR, PAPER, 7 INCH TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C 70 °C
Resistance 11000 Ω 11000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 5 ppm/°C 5 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.1% 0.05%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Additional Feature HIGH PRECISION
Package Shape RECTANGULAR PACKAGE
Reference Standard MIL-STD-202

Compare RP73A2B11KBTDF with alternatives

Compare RP73A2B11KATDG with alternatives