RNCW0402BTE2K37 vs RP73F1E2K37BTDG feature comparison

RNCW0402BTE2K37 SEI Stackpole Electronics Inc

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RP73F1E2K37BTDG TE Connectivity

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer STACKPOLE ELECTRONICS INC TE CONNECTIVITY LTD
Package Description CHIP CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e4
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.3 mm 0.3 mm
Package Length 1 mm 1 mm
Package Style SMT SMT
Package Width 0.5 mm 0.5 mm
Packing Method TR, PAPER, 7 INCH TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.063 W 0.063 W
Rated Temperature 70 °C 70 °C
Resistance 2370 Ω 2370 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0402 0402
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Finish Gold/Nickel (Au/Ni)
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.1% 0.1%
Working Voltage 25 V 25 V
Base Number Matches 1 1
Additional Feature HIGH PRECISION
Manufacturer Series RP73
Package Shape RECTANGULAR PACKAGE
Reference Standard MIL-STD-202
Series RP73

Compare RNCW0402BTE2K37 with alternatives

Compare RP73F1E2K37BTDG with alternatives