RNCF1210DTE26K1 vs RP73F2E26K1DTDG feature comparison

RNCF1210DTE26K1 SEI Stackpole Electronics Inc

Buy Now Datasheet

RP73F2E26K1DTDG TE Connectivity

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer STACKPOLE ELECTRONICS INC TE CONNECTIVITY LTD
Package Description CHIP CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8533.21.00.30
Factory Lead Time 14 Weeks
Samacsys Manufacturer Stackpole Electronics, Inc.
Additional Feature PRECISION HIGH PRECISION
Construction Rectangular Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.1 mm 3.1 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 2.4 mm 2.4 mm
Packing Method TR, Paper, 7 Inch TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.33 W 0.3 W
Rated Temperature 70 °C 70 °C
Reference Standard AEC-Q200 MIL-STD-202
Resistance 26100 Ω 26100 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1210 1210
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.5% 0.5%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Manufacturer Series RP73
Series RP73

Compare RNCF1210DTE26K1 with alternatives

Compare RP73F2E26K1DTDG with alternatives