RN73F2B10R0B vs TE06G100AB feature comparison

RN73F2B10R0B MERITEK Electronics Corporation

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TE06G100AB Fenghua (HK) Electronics Ltd

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MERITEK ELECTRONICS CORP FENGHUA ADVANCED TECHNOLOGY
Package Description CHIP, ROHS COMPLIANT CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature PRECISION
Construction Chip Rectangular
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.05 mm 3.2 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.55 mm 1.6 mm
Packing Method BULK BULK
Rated Power Dissipation (P) 0.125 W 0.125 W
Rated Temperature 70 °C 70 °C
Resistance 10 Ω 10 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.1% 0.05%
Working Voltage 150 V 150 V
Base Number Matches 1 1

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