RN73F1EB75R0B vs RP73F1E75RBTDG feature comparison

RN73F1EB75R0B MERITEK Electronics Corporation

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RP73F1E75RBTDG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MERITEK ELECTRONICS CORP TE CONNECTIVITY LTD
Package Description CHIP CHIP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature PRECISION HIGH PRECISION
Construction Rectangular Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.3 mm 0.3 mm
Package Length 1 mm 1 mm
Package Style SMT SMT
Package Width 0.5 mm 0.5 mm
Packing Method BULK TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.0625 W 0.063 W
Rated Temperature 70 °C 70 °C
Resistance 75 Ω 75 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0402 0402
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.1% 0.1%
Working Voltage 25 V 25 V
Base Number Matches 1 1
Manufacturer Series RP73
Package Shape RECTANGULAR PACKAGE
Reference Standard MIL-STD-202
Series RP73

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