RN73C1J1K02ATDG vs MCWF06W1021BTL feature comparison

RN73C1J1K02ATDG TE Connectivity

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MCWF06W1021BTL SPC Multicomp

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TE CONNECTIVITY LTD MULTICOMP PRO
Package Description CHIP, ROHS COMPLIANT CHIP
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8533.21.00.30
Additional Feature HIGH PRECISION HIGH PRECISION, LASER TRIMMABLE
Construction Chip RECTANGULAR PACKAGE
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.55 mm 1.55 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method TR, PAPER, 7 INCH TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.063 W 0.1 W
Rated Temperature 70 °C 70 °C
Resistance 1020 Ω 1020 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 10 ppm/°C 10 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.05% 0.1%
Working Voltage 50 V 50 V
Base Number Matches 1 1
Samacsys Manufacturer Multicomp Pro

Compare RN73C1J1K02ATDG with alternatives

Compare MCWF06W1021BTL with alternatives