RN104PJ560CS
vs
RNS104PJ560CS
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SAMSUNG ELECTRO-MECHANICS
|
| Package Description |
SMT, 0408
|
CHIP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8533.21.00.20
|
8533.21.00.20
|
| Construction |
Chip
|
Rectangular
|
| First Element Resistance |
56 Ω
|
56 Ω
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Network Type |
ISOLATED
|
ISOLATED
|
| Number of Elements |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.4 mm
|
0.4 mm
|
| Package Length |
2 mm
|
2 mm
|
| Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1 mm
|
1 mm
|
| Packing Method |
TR, PUNCHED PAPER, 7 INCH
|
TR, 7 Inch
|
| Rated Power Dissipation (P) |
0.0625 W
|
0.0625 W
|
| Rated Temperature |
70 °C
|
70 °C
|
| Resistance |
56 Ω
|
56 Ω
|
| Resistor Type |
ARRAY/NETWORK RESISTOR
|
ARRAY/NETWORK RESISTOR
|
| Size Code |
0408
|
0804
|
| Surface Mount |
YES
|
YES
|
| Technology |
METAL GLAZE/THICK FILM
|
WIRE WOUND
|
| Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
5%
|
5%
|
| Working Voltage |
25 V
|
25 V
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
ANTI-SULFUR
|
| Element Power Dissipation |
|
0.0625 W
|
| Second/Last Element Resistance |
|
56 Ω
|
|
|
|
Compare RN104PJ560CS with alternatives
Compare RNS104PJ560CS with alternatives