RMLV3216AGSD-5S2#AA0
vs
R1LV3216RSD-5SR#S0
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
uTSOP
|
TSOP(2)
|
| Package Description |
,
|
|
| Pin Count |
52
|
52
|
| Manufacturer Package Code |
PTSB0052LD
|
PTSB0052LB
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Factory Lead Time |
18 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Moisture Sensitivity Level |
3
|
2
|
| Base Number Matches |
1
|
1
|
| Access Time-Max |
|
55 ns
|
| Alternate Memory Width |
|
8
|
| I/O Type |
|
COMMON
|
| JESD-30 Code |
|
R-PDSO-G52
|
| Memory Density |
|
33554432 bit
|
| Memory Width |
|
16
|
| Number of Terminals |
|
52
|
| Number of Words |
|
2097152 words
|
| Number of Words Code |
|
2000000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
2MX16
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP52,.4,16
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Standby Current-Max |
|
0.000012 A
|
| Standby Voltage-Min |
|
2 V
|
| Supply Current-Max |
|
0.055 mA
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.4 mm
|
| Terminal Position |
|
DUAL
|
|
|
|
Compare RMLV3216AGSD-5S2#AA0 with alternatives
Compare R1LV3216RSD-5SR#S0 with alternatives