RMF12FT6812
vs
RC3216F6812AS
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TA-I TECHNOLOGY CO LTD
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
CHIP
|
SMT, 1206
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8533.21.00.30
|
|
| Construction |
Rectangular
|
Chip
|
| JESD-609 Code |
e3
|
e3
|
| Mounting Feature |
SURFACE MOUNT
|
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.55 mm
|
0.55 mm
|
| Package Length |
3.1 mm
|
3.2 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.55 mm
|
1.6 mm
|
| Packing Method |
TR, PAPER, 7 INCH
|
TR, Paper, 13 Inch
|
| Rated Power Dissipation (P) |
0.25 W
|
0.25 W
|
| Rated Temperature |
70 °C
|
|
| Reference Standard |
AEC-Q200
|
|
| Resistance |
68100 Ω
|
68100 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
1206
|
1206
|
| Surface Mount |
YES
|
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
-100,100 ppm/°C
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
Tin (Sn) - with Nickel (Ni) barrier
|
| Terminal Shape |
WRAPAROUND
|
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Series |
|
RC(PRECISION)
|
|
|
|
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