RMCF01005JT5603
vs
RK73B1FLTC564J
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STACKPOLE ELECTRONICS INC
|
KOA SPEER ELECTRONICS INC
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e3
|
e0
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.13 mm
|
0.12 mm
|
| Package Length |
0.4 mm
|
0.4 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.2 mm
|
0.2 mm
|
| Packing Method |
TR, Paper, 7 Inch
|
TR, PRESSED/PUNCHED PAPER, 7 INCH
|
| Rated Power Dissipation (P) |
0.03 W
|
0.03 W
|
| Resistance |
560000 Ω
|
560000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
01005
|
01005
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
250 ppm/°C
|
250 ppm/°C
|
| Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
| Tolerance |
5%
|
5%
|
| Working Voltage |
15 V
|
15 V
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
CHIP
|
| HTS Code |
|
8533.21.00.30
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
| Reference Standard |
|
MIL-R-55342F
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare RMCF01005JT5603 with alternatives
Compare RK73B1FLTC564J with alternatives