RM54AC163SFA
vs
54AC163FMQB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
DFP,
DFP, FL16,.3
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
UP
UP
Family
AC
AC
JESD-30 Code
R-GDFP-F16
R-GDFP-F16
JESD-609 Code
e0
e0
Length
9.6645 mm
9.6645 mm
Load/Preset Input
YES
YES
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Mode of Operation
SYNCHRONOUS
SYNCHRONOUS
Moisture Sensitivity Level
1
Number of Bits
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DFP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
12.5 ns
9.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.032 mm
2.032 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
6.604 mm
6.604 mm
fmax-Min
90 MHz
90 MHz
Base Number Matches
1
4
Additional Feature
TCO OUTPUT
Load Capacitance (CL)
50 pF
Max I(ol)
0.012 A
Package Equivalence Code
FL16,.3
Packing Method
RAIL
Screening Level
38535Q/M;38534H;883B
Compare RM54AC163SFA with alternatives
Compare 54AC163FMQB with alternatives