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RM25J330BP vs RM25JE330 feature comparison

RM25J330BP Cal-Chip Electronics

Buy Now Datasheet

RM25JE330 TA-I Technology Co Ltd

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer CAL-CHIP ELECTRONICS INC TA-I TECHNOLOGY CO LTD
Package Description CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Glass Coat Chip
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.6 mm
Package Length 6.3 mm 6.3 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 0.5 mm 3.2 mm
Packing Method BULK Tape, Embossed
Rated Power Dissipation (P) 1 W 1 W
Rated Temperature 70 °C
Resistance 33 Ω 33 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2512 2512
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 5% 5%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

Compare RM25J330BP with alternatives

Compare RM25JE330 with alternatives