RM25FL1872
vs
BCR11872FE
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TA-I TECHNOLOGY CO LTD
TT ELECTRONICS PLC
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
Construction
Chip
Thick Film
JESD-609 Code
e3
e0
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
6.3 mm
6.3 mm
Package Style
SMT
SMT
Package Width
3.2 mm
3.2 mm
Packing Method
Tape, Paper
TR, EMBOSSED
Rated Power Dissipation (P)
1 W
1 W
Resistance
18700 Ω
18700 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2512
2512
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Tin (Sn) - with Nickel (Ni) barrier
Tin/Lead (Sn/Pb)
Tolerance
1%
1%
Working Voltage
200 V
200 V
Base Number Matches
1
2
Package Description
CHIP
Manufacturer Series
BCR
Mounting Feature
SURFACE MOUNT
Package Shape
RECTANGULAR PACKAGE
Rated Temperature
70 °C
Series
BCR
Surface Mount
YES
Terminal Shape
WRAPAROUND
Compare RM25FL1872 with alternatives
Compare BCR11872FE with alternatives