RM20FEN8870 vs 201007F8870B4E feature comparison

RM20FEN8870 TA-I Technology Co Ltd

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201007F8870B4E Royal Electronic Factory (Thailand) Co Ltd

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TA-I TECHNOLOGY CO LTD ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP, LEAD FREE
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.55 mm
Package Length 5 mm 5 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 2.5 mm 2.5 mm
Packing Method TR, Embossed Plastic, 7 Inch
Rated Power Dissipation (P) 0.75 W 0.75 W
Rated Temperature 70 °C
Resistance 887 Ω 887 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Series 2010(3/4WS,F TOL)

Compare RM20FEN8870 with alternatives

Compare 201007F8870B4E with alternatives