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RM12J750CTDK vs TSR8GTJ750V feature comparison

RM12J750CTDK Cal-Chip Electronics

Buy Now Datasheet

TSR8GTJ750V Tateyama Kagaku Group

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer CAL-CHIP ELECTRONICS INC TATEYAMA KAGAKU GROUP
Package Description CHIP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Rectangular Chip
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.6 mm
Package Length 3.1 mm 3.2 mm
Package Style SMT SMT
Package Width 1.55 mm 1.6 mm
Packing Method TR, PAPER, 7 INCH Tape
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C
Resistance 75 Ω 75 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Shape WRAPAROUND
Tolerance 5% 5%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

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Compare TSR8GTJ750V with alternatives