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RM12FL2370 vs RM12FBN2370 feature comparison

RM12FL2370 TA-I Technology Co Ltd

Buy Now Datasheet

RM12FBN2370 TA-I Technology Co Ltd

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TA-I TECHNOLOGY CO LTD TA-I TECHNOLOGY CO LTD
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e3 e3
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.55 mm
Package Length 3.1 mm 3.1 mm
Package Style SMT SMT
Package Width 1.55 mm 1.55 mm
Packing Method Tape, Paper BULK CASSETTE
Rated Power Dissipation (P) 0.25 W 0.25 W
Resistance 237 Ω 237 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Tin (Sn) - with Nickel (Ni) barrier
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Pbfree Code Yes
Package Description CHIP, LEAD FREE
HTS Code 8533.21.00.30
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Surface Mount YES
Terminal Shape WRAPAROUND
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

Compare RM12FL2370 with alternatives

Compare RM12FBN2370 with alternatives