RM12FBN3831 vs RM12FL3831 feature comparison

RM12FBN3831 TA-I Technology Co Ltd

Buy Now Datasheet

RM12FL3831 TA-I Technology Co Ltd

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TA-I TECHNOLOGY CO LTD TA-I TECHNOLOGY CO LTD
Package Description CHIP, LEAD FREE
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Chip Chip
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.6 mm
Package Length 3.1 mm 3.1 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.55 mm 1.55 mm
Packing Method BULK CASSETTE Tape, Paper
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C
Resistance 3830 Ω 3830 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1

Compare RM12FBN3831 with alternatives

Compare RM12FL3831 with alternatives