RM12F9311CT vs MR12X9311FGL feature comparison

RM12F9311CT Cal-Chip Electronics

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MR12X9311FGL Walsin Technology Corporation

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer CAL-CHIP ELECTRONICS INC WALSIN TECHNOLOGY CORP
Package Description SMT, 1206 CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.6 mm
Package Length 3.1 mm 3.1 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.55 mm 1.6 mm
Packing Method TR, Paper, 7 Inch TR, PAPER, 13 INCH
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C 70 °C
Resistance 9310 Ω 9310 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish MATTE TIN OVER NICKEL TIN
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Additional Feature ANTI-SULFUR, RATED AC VOLTAGE (V): 200
Reference Standard AEC-Q200; MIL-STD-202

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