RM12F56R2CT-H vs MC1206P-56R2-FB101Q feature comparison

RM12F56R2CT-H Cal-Chip Electronics

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MC1206P-56R2-FB101Q RCD Components Inc

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Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer CAL-CHIP ELECTRONICS INC RCD COMPONENTS INC
Package Description SMT, 1206 CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Construction Rectangular Chip
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.61 mm
Package Length 3.1 mm 3.2 mm
Package Style SMT SMT
Package Width 1.55 mm 1.55 mm
Packing Method TR, PAPER, 7 INCH BULK
Rated Power Dissipation (P) 0.33 W 0.25 W
Rated Temperature 70 °C
Resistance 56.2 Ω 56.2 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish MATTE TIN OVER NICKEL Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Pbfree Code No
Additional Feature PRECISION
JESD-609 Code e0
Package Shape RECTANGULAR PACKAGE

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Compare MC1206P-56R2-FB101Q with alternatives