RM12F3831CTDK vs MR12X3831FTL feature comparison

RM12F3831CTDK Cal-Chip Electronics

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MR12X3831FTL Walsin Technology Corporation

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer CAL-CHIP ELECTRONICS INC WALSIN TECHNOLOGY CORP
Package Description CHIP CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8533.21.00.30
Construction Rectangular Chip
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.6 mm
Package Length 3.1 mm 3.1 mm
Package Style SMT SMT
Package Width 1.55 mm 1.6 mm
Packing Method TR, PAPER, 7 INCH TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C 70 °C
Resistance 3830 Ω 3830 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Rohs Code Yes
Additional Feature ANTI-SULFUR, RATED AC VOLTAGE (V): 200
JESD-609 Code e3
Reference Standard AEC-Q200; MIL-STD-202
Terminal Finish TIN

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