RM12BLN1130
vs
RM12BBN1130
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TA-I TECHNOLOGY CO LTD
|
TA-I TECHNOLOGY CO LTD
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e3
|
e3
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.6 mm
|
0.55 mm
|
| Package Length |
3.1 mm
|
3.1 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.55 mm
|
1.55 mm
|
| Packing Method |
Tape, Paper
|
BULK CASSETTE
|
| Rated Power Dissipation (P) |
0.25 W
|
0.25 W
|
| Resistance |
113 Ω
|
113 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
1206
|
1206
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
Tin (Sn) - with Nickel (Ni) barrier
|
| Tolerance |
0.1%
|
0.1%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
CHIP, LEAD FREE
|
| HTS Code |
|
8533.21.00.30
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare RM12BLN1130 with alternatives
Compare RM12BBN1130 with alternatives