RM10J222CTDK-H
vs
SG73P2ALTD222J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CAL-CHIP ELECTRONICS INC
KOA SPEER ELECTRONICS INC
Package Description
CHIP
CHIP
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Construction
Rectangular
Chip
JESD-609 Code
e3
e0
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.5 mm
0.5 mm
Package Length
2 mm
2 mm
Package Style
SMT
SMT
Package Width
1.25 mm
1.25 mm
Packing Method
TR, PAPER, 7 INCH
TR, PAPER, 7 INCH
Rated Power Dissipation (P)
0.33 W
0.25 W
Rated Temperature
70 °C
70 °C
Resistance
2200 Ω
2200 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0805
0805
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
TIN OVER NICKEL
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
5%
5%
Working Voltage
150 V
150 V
Base Number Matches
1
1
Pbfree Code
No
Rohs Code
No
Package Shape
RECTANGULAR PACKAGE
Compare RM10J222CTDK-H with alternatives
Compare SG73P2ALTD222J with alternatives