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RM10F2370CTDK vs RC2012F2370CS feature comparison

RM10F2370CTDK Cal-Chip Electronics

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RC2012F2370CS Samsung Electro-Mechanics

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer CAL-CHIP ELECTRONICS INC SAMSUNG ELECTRO-MECHANICS
Package Description CHIP CHIP, ROHS COMPLIANT
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Construction Rectangular Rectangular
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.5 mm 0.55 mm
Package Length 2 mm 2 mm
Package Style SMT SMT
Package Width 1.25 mm 1.25 mm
Packing Method TR, PAPER, 7 INCH TR, Paper, 7 Inch
Rated Power Dissipation (P) 0.125 W 0.125 W
Rated Temperature 70 °C 70 °C
Resistance 237 Ω 237 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0805 0805
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 150 V 150 V
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Factory Lead Time 45 Weeks
JESD-609 Code e3
Package Shape RECTANGULAR PACKAGE
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

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