RM06FBN2103 vs MCR03EZHFX2103 feature comparison

RM06FBN2103 TA-I Technology Co Ltd

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MCR03EZHFX2103 ROHM Semiconductor

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TA-I TECHNOLOGY CO LTD ROHM CO LTD
Package Description CHIP, LEAD FREE CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Construction Chip Chip
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.6 mm 1.6 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method BULK CASSETTE TR, PAPER
Rated Power Dissipation (P) 0.1 W 0.063 W
Rated Temperature 70 °C 70 °C
Resistance 210000 Ω 210000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 50 V 50 V
Base Number Matches 1 1
Manufacturer Series MCR03
Series MCR03(FX,E-96)

Compare RM06FBN2103 with alternatives

Compare MCR03EZHFX2103 with alternatives