RL106GP-T
vs
RL106-TP
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
MICRO COMMERCIAL COMPONENTS CORP
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| JESD-609 Code |
e0
|
e3
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
10
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
O-PALF-W2
|
| Pin Count |
|
2
|
| HTS Code |
|
8541.10.00.80
|
| Samacsys Manufacturer |
|
MCC
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Application |
|
GENERAL PURPOSE
|
| Case Connection |
|
ISOLATED
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| Diode Type |
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
|
1.1 V
|
| JESD-30 Code |
|
O-PALF-W2
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Pk Forward Current-Max |
|
30 A
|
| Number of Elements |
|
1
|
| Number of Phases |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
150 °C
|
| Output Current-Max |
|
1 A
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Qualification Status |
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
|
800 V
|
| Reverse Current-Max |
|
5 µA
|
| Surface Mount |
|
NO
|
| Terminal Form |
|
WIRE
|
| Terminal Position |
|
AXIAL
|
|
|
|
Compare RL106GP-T with alternatives
Compare RL106-TP with alternatives