RK73H2HLTED1R00F
vs
MC2010L6F1R00SE
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
KOA SPEER ELECTRONICS INC
SPC TECHNOLOGY/ MULTICOMP
Package Description
CHIP
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
Additional Feature
PRECISION
Construction
Rectangular
Multilayer Chip
JESD-609 Code
e0
Mounting Feature
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.55 mm
Package Length
5 mm
5 mm
Package Style
SMT
SMT
Package Width
2.5 mm
2.5 mm
Packing Method
TR, EMBOSSED PLASTIC, 10 INCH
TR, Embossed Plastic, 7 Inch
Rated Power Dissipation (P)
0.75 W
0.75 W
Rated Temperature
70 °C
Reference Standard
AEC-Q200
Resistance
1 Ω
1 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Tin/Lead (Sn90Pb10) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
1%
1%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Compare RK73H2HLTED1R00F with alternatives
Compare MC2010L6F1R00SE with alternatives