RK73H2HLTEB57R6F vs RS10K57R6FBG feature comparison

RK73H2HLTEB57R6F KOA Speer Electronics Inc

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RS10K57R6FBG Fenghua (HK) Electronics Ltd

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Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer KOA SPEER ELECTRONICS INC FENGHUA ADVANCED TECHNOLOGY
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
Construction Chip RECTANGULAR PACKAGE
JESD-609 Code e0
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.55 mm
Package Length 5 mm 5 mm
Package Style SMT SMT
Package Width 2.5 mm 2.5 mm
Packing Method TR, 13 Inch Bulk
Rated Power Dissipation (P) 0.75 W 0.75 W
Resistance 57.6 Ω 57.6 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin/Lead (Sn90Pb10) - with Nickel (Ni) barrier
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Package Description CHIP
HTS Code 8533.21.00.30
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Surface Mount YES
Terminal Shape WRAPAROUND

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