RK73H2HLTEB1801F
vs
RMEF2010FT1K80
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
KOA SPEER ELECTRONICS INC
|
STACKPOLE ELECTRONICS INC
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| Construction |
Chip
|
Rectangular
|
| JESD-609 Code |
e0
|
e3
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.6 mm
|
0.55 mm
|
| Package Length |
5 mm
|
5 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
2.5 mm
|
2.5 mm
|
| Packing Method |
TR, 13 Inch
|
TR, Embossed Plastic, 7 Inch
|
| Rated Power Dissipation (P) |
0.75 W
|
0.75 W
|
| Resistance |
1800 Ω
|
1800 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
2010
|
2010
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn90Pb10) - with Nickel (Ni) barrier
|
MATTE TIN OVER NICKEL
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
CHIP
|
| Factory Lead Time |
|
14 Weeks
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Rated Temperature |
|
70 °C
|
| Reference Standard |
|
AEC-Q200
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare RK73H2HLTEB1801F with alternatives
Compare RMEF2010FT1K80 with alternatives