RK73H2BTTDB6650F
vs
MR12X6650FQL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
KOA SPEER ELECTRONICS INC
WALSIN TECHNOLOGY CORP
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
Construction
Chip
Chip
JESD-609 Code
e3
e3
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
3.2 mm
3.1 mm
Package Style
SMT
SMT
Package Width
1.6 mm
1.6 mm
Packing Method
TR, 13 Inch
TR, PAPER, 10 INCH
Rated Power Dissipation (P)
0.25 W
0.25 W
Resistance
665 Ω
665 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1206
1206
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
MATTE TIN OVER NICKEL
TIN
Tolerance
1%
1%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Package Description
CHIP
HTS Code
8533.21.00.30
Additional Feature
ANTI-SULFUR, RATED AC VOLTAGE (V): 200
Mounting Feature
SURFACE MOUNT
Rated Temperature
70 °C
Reference Standard
AEC-Q200; MIL-STD-202
Surface Mount
YES
Terminal Shape
WRAPAROUND
Compare RK73H2BTTDB6650F with alternatives
Compare MR12X6650FQL with alternatives