RK73H1HTTB3002F vs RC01W303FBG feature comparison

RK73H1HTTB3002F KOA Speer Electronics Inc

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RC01W303FBG Fenghua (HK) Electronics Ltd

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer KOA SPEER ELECTRONICS INC FENGHUA ADVANCED TECHNOLOGY
Package Description CHIP, ROHS COMPLIANT CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature PRECISION, STANDARD : MIL-R-55342F
Construction Chip RECTANGULAR PACKAGE
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.23 mm 0.23 mm
Package Length 0.6 mm 0.6 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 0.3 mm 0.3 mm
Packing Method TR, PRESSED PAPER Bulk
Rated Power Dissipation (P) 0.05 W 0.05 W
Rated Temperature 70 °C 70 °C
Reference Standard MIL-R-55342F
Resistance 30000 Ω 30000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0201 0201
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 25 V 25 V
Base Number Matches 1 1

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