RK73B2HLTDD821J
vs
201007J0821B5E
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
KOA SPEER ELECTRONICS INC
ROYAL ELECTRONIC FTY CO LTD
Package Description
CHIP
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
Construction
Chip
Chip
JESD-609 Code
e0
Mounting Feature
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.55 mm
Package Length
5 mm
5 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.5 mm
2.5 mm
Packing Method
TR, PAPER, 10 INCH
Rated Power Dissipation (P)
0.75 W
0.75 W
Rated Temperature
70 °C
Resistance
820 Ω
820 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Tin/Lead (Sn90Pb10) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
5%
5%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Series
2010(3/4WS,GJ TOL)
Compare RK73B2HLTDD821J with alternatives
Compare 201007J0821B5E with alternatives