RK73B1FLTDD363J vs MCR004RZPJ363 feature comparison

RK73B1FLTDD363J KOA Speer Electronics Inc

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MCR004RZPJ363 ROHM Semiconductor

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Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer KOA SPEER ELECTRONICS INC ROHM CO LTD
Reach Compliance Code not_compliant compliant
ECCN Code EAR99
Construction Chip Chip
JESD-609 Code e0 e3
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.12 mm 0.13 mm
Package Length 0.4 mm 0.4 mm
Package Style SMT SMT
Package Width 0.2 mm 0.2 mm
Packing Method Tape, Paper TR, EMBOSSED, 7 INCH
Rated Power Dissipation (P) 0.03 W 0.031 W
Reference Standard MIL-R-55342F TS 16949
Resistance 36000 Ω 36000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 01005 01005
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 250 ppm/°C 250 ppm/°C
Terminal Finish Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier Tin (Sn)
Tolerance 5% 5%
Working Voltage 15 V 15 V
Base Number Matches 1 1
Package Description CHIP
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Surface Mount YES
Terminal Shape WRAPAROUND

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Compare MCR004RZPJ363 with alternatives