RHFAC157K02V
vs
5962-8953901FA
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
TELEDYNE E2V (UK) LTD
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Family |
AC
|
AC
|
| JESD-30 Code |
R-CDFP-F16
|
R-GDFP-F16
|
| Length |
9.94 mm
|
9.6645 mm
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
150 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DFP
|
DFP
|
| Package Equivalence Code |
FL16,.3
|
FL16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Packing Method |
TR
|
|
| Screening Level |
MIL-PRF-38535 Class V
|
MIL-STD-883
|
| Seated Height-Max |
2.38 mm
|
2.032 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Total Dose |
300k Rad(Si) V
|
|
| Width |
6.91 mm
|
6.604 mm
|
| Base Number Matches |
1
|
4
|
| Part Package Code |
|
DFP
|
| Package Description |
|
DFP, FL16,.3
|
| Pin Count |
|
16
|
| JESD-609 Code |
|
e0
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.012 A
|
| Prop. Delay@Nom-Sup |
|
11 ns
|
| Propagation Delay (tpd) |
|
11 ns
|
| Qualification Status |
|
Qualified
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare RHFAC157K02V with alternatives
Compare 5962-8953901FA with alternatives