RH829AE3 vs RH829A feature comparison

RH829AE3 Microsemi Corporation

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RH829A Microsemi Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description O-LALF-W2 HERMETIC SEALED, GLASS, DO-7, 2 PIN
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AA DO-204AA
JESD-30 Code O-LALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Power Dissipation-Max 0.5 W 0.5 W
Reference Voltage-Nom 6.2 V 6.2 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max 0.031 mV/°C 0.031 mV/°C
Voltage Tol-Max 4.84% 4.84%
Base Number Matches 1 1
Rohs Code No
Part Package Code DO-7
Pin Count 2
Dynamic Impedance-Max 10 Ω
JESD-609 Code e0
Qualification Status Not Qualified
Terminal Finish TIN LEAD
Working Test Current 7.5 mA

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