RH821E3 vs BZV80TRL13 feature comparison

RH821E3 Microsemi Corporation

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BZV80TRL13 NXP Semiconductors

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP NXP SEMICONDUCTORS
Package Description O-LALF-W2 O-LELF-R2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AA
JESD-30 Code O-LALF-W2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Power Dissipation-Max 0.5 W
Reference Voltage-Nom 6.2 V 6.2 V
Surface Mount NO YES
Technology ZENER ZENER
Terminal Form WIRE WRAP AROUND
Terminal Position AXIAL END
Voltage Temp Coeff-Max 0.62 mV/°C 0.62 mV/°C
Voltage Tol-Max 4.84%
Base Number Matches 1 1
Qualification Status Not Qualified
Working Test Current 7.5 mA

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